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  1. Glob tops are designed to exhibit specific properties in order to protect and support electronic components. They are electrically insulative, resistant to moisture and chemicals, and are …

  2. Glob tops are encapsulations that protect fragile semiconductor die and wire bonds. They are placed over chips as an environmental barrier, mechanical reinforcement, or tamper proof layer.

  3. LOCTITE ECCOBOND FP4323 liquid epoxy encapsulant glob top is designed with flow capabilities that allows encapsulation without flowing beyond the chip. The above cure profiles …

  4. Glob top technology : application of an encapsulant to protect components from environmental & mechanical damage so old : developed in the 60's, very familiar for consumer applications …

  5. GLR is a thixotropic, hot cure, single-part epoxy, designed for the discreet protection of electrical and electronic components by dipping or ‘glob topping’.

  6. Our selection charts / material selection guides are a technical selection aid giving an overview of various product variants. We will be pleased to provide you with sales details, such as …

  7. The asterisk is a wild card character that can be used in place of any part of the file name – the glob tool returns any file names that satisfy the portion of the file name that was specified.