Canada continues to fall further behind peers in key measures of science, technology, and innovation performance. A new report from the Council of Canadian Academies (CCA) details the daunting ...

The findings could open a route to new forms of higher-temperature superconductors Superconductors are like the express trains in a metro system. Any electricity that “boards” a superconducting ...

Ten tech start-ups compete for $50,000 in cash prizes ventureLAB has announced the finalists for the 2025 HardTech Pitch Competition after 10 start-ups took the stage on Day 1 of the tech gathering in ...

China is getting around export bans on the sale of powerful American AI chips by renting them through U.S. cloud services instead, AP finds U.S. lawmakers have tried four times since September last ...

AI agents solve real-world chip design, verification tasks, helps engineers save 40% of their time on repetitive low-level tasks Today Chipmind, a European startup building AI agents to accelerate the ...

BOPLA BoVersa enclosure concept is suitable for next-generation wireless, embedded and instrumentation systems. Combining modern design with robust engineering, Product line maximizes flexibility for ...

S-P International has been officially appointed the distributor of Degson products in Canada. The partnership marks a significant milestone and reaffirms our commitment to providing top-quality ...

Nvidia, the world’s leading chipmaker, announced on Thursday that it’s investing $5 billion in Intel and will collaborate with the struggling semiconductor company. Nvidia said it will spend $5 ...

10am – https://us06web.zoom.us/webinar/register/WN_pPvQWdwEQGeO_p4xd_o8QA 2pm – https://us06web.zoom.us/webinar/register/WN_NFxzJ1M4SS63T7VVVmR57A Claigan will ...

TE CONNECTIVITY Ultra Low-Profile (ULP) PCIe Gen 7 connectors and cable assemblies enable the data speeds and electrical performance that next-generation data centres and AI applications demand.

In an industry where performance and reliability often trump sustainability, one UK-based startup is flipping the script — and the substrate. Jiva Materials Ltd., founded by Jack Herring, is shaking ...

Apple is expected to launch its first foldable smartphone in 2026, and competition among potential component suppliers is already intensifying. According to Patently Apple, which cited a well-known ...