The independent technology information source for electronics engineers, programmers and developers.

The independent technology information source for electronics engineers, programmers and developers.

The independent technology information source for electronics engineers, programmers and developers.

How VisualSim Architect models complex multi-die and chiplet-based systems before implementation. Why UCIe latency analysis is important when integrating chiplets from different vendors. How comparing ...

Andy’s back from the 2026 Analog Aficionados meetup, held at DesignCon this year, and pieces together some history of the event as well as launching a downloadable annual calendar commemorating the ...

Three of Electronic Design’s most colorful editors will be attending North America’s leading power conference and would love ...

UCIe 3.0 springs open the door to higher speeds, enhanced link reliability, and smarter system coordination for increasingly complex chiplet packaging needs.

AI has been a powerful force in the embedded electronics industry, although it’s still in its infancy. It has a great promise to automate systems in every facet of the industry, yet it’s not a silver ...

Check out the breaking news, videos, and podcasts at this year's Embedded World conference. Mick Posner highlights Cadence’s chiplet platform to support physical AI development. Multiphase Power ...

In celebration of International Women's Day, I did a special drawing to capture the event.

Using LnFP technology as an active material, OMI said it has developed a rapid ion transport cathode designed to handle ...

Infineon gives vertical power delivery a push with a new generation of multiphase power modules that can be tucked underneath ...