Rohm Semiconductor has added a new thermal analysis function its Solution Simulator, enabling automotive and industrial circuit and system designers to verify power device and driver IC thermal issues ...

The COMSOL Multiphysics® modelling and simulation software is used in all fields of engineering, manufacturing and scientific ...

The shift to advanced packaging in 3D and 2.5D IC design is making the numerical analysis of thermal warpage in electronic devices a crucial part of the design process. A reliable numerical tool ...

The drive for better efficiency in the power electronics industry has generated enormous gains in the last few years. The design of power semiconductors has improved, silicon carbide (SiC) and gallium ...

As the speed, density, and capabilities of electronics have all increased, power has become a first order driver in almost all electronic systems. For instance, it’s well recognized that heat is often ...

Chinese scientists have analyzed reports of thermal issues with vanadium redox flow batteries (VRFB) and existing thermal management methods. They say the operating temperature should be maintained in ...

Today’s complex SoCs are prone to thermal issues that can cause field failures. Here’s how thermal analysis can help you ferret out those hotspots. As the semiconductor industry traverses through the ...

Safer batteries, specifically Li-ion batteries, have gained significant attention in the last few years owing to their extensive use as energy storage systems in many applications, including ...

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