Wire bonding is widely used in electronic devices, the semiconductor industry, and microelectronics. It enables interconnections between the die and other electronic components in an integrated ...
Three-dimensional stacked integrated circuits (3D-ICs) are composed of multiple stacked die, and are viewed as critical in helping the semiconductor industry keep pace with Moore’s Law. Current ...
CHARLOTTE, N.C. — Engineers from three semiconductor companies detailed their experience using novel design-for-test techniques to speed chip testing during volume manufacturing at the International ...
The testing of the semiconductor dies produced by a wafer fabrication plant involves a long series of operations requiring meticulous care. The time spent performing these tests markedly affects both ...
Rapidly increasing chip and package complexity, coupled with an incessant demand for more reliability, has triggered a frenzy of alliances and working relationships that are starting to redefine how ...
Accurately estimating the junction temperature of a semiconductor device is essential for ensuring its reliability, performance, and longevity. Junction temperature has a direct influence on the ...
IC testing solution provider Chunghwa Precision Test Technology (CHPT) saw its 2016 revenues climb to a record high of NT$2.595 billion (US$80.1 million), which represented a 50.4% increase from the ...
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